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Company History

The History of Shikino High-Tech

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    • Jan 1975
    • Shikino Co. Ltd. was established with a capital investment of 4 million yen wholly funded by Shikino Electroplating Corporation, and began the purchase and sale of plating materials.
    • Feb 1985
    • A 3-storey 677 m2 company building was newly constructed in Eguchi, Uozu-shi in Toyama.
    • May 1986
    • The decision was taken to expand into the electronics field as the electronics division of Shikino Electroplating Corporation.
    • Jul 1986
    • Software development activities were initiated in such areas as factory production management systems.
    • Nov 1986
    • The development of software and hardware for microcomputers was initiated.
    • May 1987
    • The design and production of circuit boards for testing semiconductors (burn-in boards) was initiated.
    • Jan 1988
    • After taking charge of the electronics division of Shikino Electroplating Corporation, the company name was changed to Shikino Electronics Co. Ltd.
    • May 1988
    • Capital funds were increased to 16 million yen.
    • Aug 1988
    • IC layout design activities were initiated.
    • Apr 1990
    • Measurement technology related activities were initiated.
    • Aug 1990
    • Capital funds were increased to 35 million yen.
    • Jan 1992
    • The company name was changed to Shikino High-Tech Co. Ltd.
    • Feb 1992
    • Capital funds were increased to 60 million yen.
    • Sep 1994
    • The company’s own burn-in board inspection system (BIS) was developed.
    • Dec 1998
    • The 697 m2 Kichijima Factory was newly built in Kichijima, Uozu-shi.
    • Mar 2001
    • Acquisition of ISO14001 certification.
    • Nov 2003
    • Capital funds were increased to 111,110,000 yen
    • Oct 2004
    • Acquisition of ISO9001 certification.
    • Nov 2004
    • The company took on the electronics-related operations of Kanebo Co. Ltd., and set up the Osaka Design Center.
    • Nov 2004
    • The Kyushu Branch was established in Kitakyushu City.
    • Mar 2005
    • Capital funds were increased to 150,310,000 yen.
    • Oct 2005
    • The Osaka Design Center acquired ISO9001 certification. The Tokyo Technical Centre was established in Minato-ku, Tokyo.
    • Jan 2006
    • The company took a transfer of semiconductor testing equipment operations from Ono Sokki.
    • Apr 2006
    • The company’s original burn-in board inspection system (BIS) was developed.
    • Aug 2006
    • The Osaka Design Center moved to Yodogawa-ku, Osaka.
    • Nov 2006
    • Winner of the 13th Business Grand Prix Toyama management division prize.
    • Mar 2007
    • The Osaka Design Center acquired ISO14001 certification.
    • Oct 2007
    • A technology building was newly constructed at the Kichijima Factory.
    • Apr 2010
    • The second storey space of the Tokyo Technical Center was expanded.