We offer analog LSI design based around power supply technology, digital LSI design based around image technology, and mixed digital/analog LSI categories such as mobile communication devices, as well as optimum ASIC solutions from LSI design to prototyping and mass production.
Focusing on the development of customized cameras and image processing modules, we can respond with our flexible system and broad skill set to meet various needs from specification design to board installation.
We can realize the design and manufacture of testing boards necessary for LSI gauging in accordance with customers’ needs. We contribute to the prompt startup of production lines by carrying out debugging of production jigs using tester programs before delivery.
Our production experience of numerous board types as a top-class Japanese supplier of burn-in boards and our manufacturing capability that can support an extensive range of board specs put us in a position to offer you burn-in testing solutions.
Our surface mount line features support for circuit board sizes of up to 508 (W) × 620 (L) mm as standard. We are also open to consultation in relation to sizes greater than this. We are able to meet various needs, from individual or small-batch production types to mass production types. We also support minute parts and flip chips regardless of board size with our advanced mounting technology.