Solutions & Services
Camera / System Development
We offer optimum solutions in response to various demands based around custom camera and image processing modules. We provide strong backup to our customers’ development efforts with our broad technological base and our wealth of experience. Our strength lies in our integrated handling of the entire development process, from product specification design to mass production supply.
Features
- ● We also offer custom lens development
- ● We carry out module development based around image processing.
- ● We also offer ASIC development to allow product differentiation.
- ● We can provide total support for everything from specification design to substrate mounting.
Our excellent track record yields reliability and security
- Focusing on custom cameras and image processing modules, we offer everything from design and development to substrate mounting.
Compact camera module
Biometric identification module
High-speed data transfer module
High technical capability and reliable support
・Specification design, system design
・Circuit design, artwork design
・FPGA design (Verilog-HDL,VHDL), ASIC development (digital / analog LSIs)
・Development of firmware and application software
・Development of custom lenses
・High-quality manufacturing system implemented by our factories in Japan
・Staffed by employees who have passed certification tests on electronic component assembly skills or on JAXA-certified micro-soldering skills (JAXA: Japan Aerospace Exploration Agency)
・Technical support provided by engineers specializing in cameras, in addition to those specializing in hardware, software, or LSI
・Quality assurance system by our quality control departments
Support for flexible customization
・We also handle prototype production and small-lot batch production.
・We also offer housing design and production.
・We are happy to take on design work at any phase in the process.
Main equipment
- ● Board design
- ZUKEN CR5000; PADS Power-PCB system; Mentor Expedition PCB; Cadlus
- ● Mounting equipment
- Solder printing
Automatic paste printing machines: Horizon02i (510×508×6.0mm); ELA264 (510×508×6.0mm) - Element placement
Mounters: MY-15 (620×750×6.0mm); MY-12 (508×610×3.5mm) - Reflow soldering
Reflow furnace (forced convection): NV-12N (457×470×1.6mm)
Reflow furnace (hot air on upper surface and far infrared rays on lower surface): NRY-550PW-7 (510×610×6.0mm) - Flow soldering
Automatic jet solder bath: YSM-813DS (350×610×1.6mm)
Automatic static solder bath: UDS-500L (500×610×1.6mm)