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Information of our exhibition at the 13th IC Packaging Technology Expo

Exhibition info

2011/12/29

Here is the announcement of our exhibition at the 13th IC Packaging Technology Expoheld from Wednesday,
January 18 to Friday, January 20 in Tokyo Big Sight. In the booth of Shikino High-Tech, we will exhibit
SHSA-101, a PXI standard-compliant 8-channel source measure unit we newly developed and started the sales
this fall, and introduce our products by demonstration. We are looking forward to your visit at our booth.

Please feel free to contact us regarding questions about our exhibition at the 13th IC Packaging Technology Expo.

13th IC Packaging Technology Expo

Exhibition Date

Wednesday, January 18 to Friday, January 20
10:00 a.m. to 6:00 p.m.
*They open until 5:00 p.m. only on January 20.

Venue

TokyoBig Sight
Our booth number: West 3-37

Host Reed Exhibitions Japan Ltd.
Exhibited Items

- PXI standard-compliant 8-channel source measure unit module
- Burn-in equipment, analog tester and open/short/leakage tester
- Entrustedjig developmentservicesfor semiconductor tests
- Application development service for semiconductor inspection

Website http://www.nepcon.jp/
Online Invitation ICP2012.pdf
<Our contact> nepcon2012@shikino.co.jp

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