Thank you for visiting our booth at the 13th IC Packaging Technology Expo

We participated at the 13^th IC Packaging Technology Expoheld from Wednesday, January 18 to Friday, January 20 in Tokyo
Big Sight. Thank you very much for visiting our booth.

Please feel free to contact us with inquiries regarding our exhibits at the 13^th IC Packaging Technology Expo.

The 13^th IC Packaging Technology Expo
Exhibition Date	Wednesday, January 18 to Friday, January 20 10:00 a.m. to 6:00 p.m. *They open until 5:00 p.m. only on January 20.
Venue	TokyoBig Sight Our booth number: West 3-37
Host	Reed Exhibitions Japan Ltd.
Exhibited Items	- PXI standard-compliant 8-channel source measure unit module - Burn-in equipment, analog tester and open/short/leakage tester - Entrustedjig developmentservicesfor semiconductor tests - Application development service for semiconductor inspection
Website	http://www.nepｃon.jp/
Online Invitation	ICP2012.pdf
＜Our contact＞ nepcon2012@shikino.co.jp

Thank you for visiting our booth at the 13th IC Packaging Technology Expo

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